DISPERBYK-111
Solvent-free W&D for SB/SF systems to stabilize TiO2. Acid value 129 mg KOH/g.
Solvent-free W&D for SB/SF systems to stabilize TiO2. Acid value 129 mg KOH/g.
All-purpose W&D for SB systems: TiO2, inorganic pigments, fillers, and effect pigments. No negative impact on metal adhesion.
⚠ BYK recommends NOT using for new developments — contact BYK for alternatives.
W&D for SB coatings and pigment concentrates. Particularly for CN and TPA systems.
W&D for SB automotive/industrial coatings. Particularly for fine carbon blacks and organic pigments.
Widely compatible W&D for SB systems. For new developments, prefer DISPERBYK-2163.
Aromatic-free version of DISPERBYK-163. Broad compatibility for all-purpose pigment concentrates.
W&D for SB/SF UV/radiation-curable coatings and printing inks. 55% bio-based carbon content.
W&D for SB coatings. Suitable for PVDF systems and acid-catalyzed coil coatings.
W&D for SB coil coatings and unsaturated polyester resin systems/gel coats.
Solvent-free universal W&D for aqueous/SB/SF systems. Low-VOC and VOC-free capable.
Additive for increasing colorant acceptance in aqueous systems. Improves tinting, storage stability, gloss.
Standard W&D for binder-free pigment concentrates in aqueous systems. VOC- and solvent-free.
Solvent-free W&D for aqueous printing inks and binder-containing pigment concentrates.
Solvent-free W&D for aqueous systems, especially 2K PUR and 2K epoxy waterborne.
VOC-free, APEO-free, amine-free W&D for aqueous coatings. Electrosteric stabilization.